Dedicated ML-KEM acceleration chiplet for OEM integration. 4mm squared die, SkyWater SKY130 process, with proprietary QLI die-to-die interface for multi-chiplet configurations.
Current silicon revisions, errata, and design updates for the QCORE-C1 chiplet.
BrowseGet started with QCORE-C1 integration, from evaluation board setup to first cryptographic operation.
BrowseDetailed hardware architecture including NTT engine pipeline, memory subsystem, and QLI interface design.
BrowseSoftware development guide for QCORE-C1 including register programming, DMA operations, and firmware integration.
BrowsePCB design guidelines, power delivery, signal integrity, and thermal management for QCORE-C1 integration.
BrowseComplete specification for the Quantum Link Interface die-to-die protocol.
BrowseTechnical comparison between Dyber's QLI interface and the UCIe standard.
BrowseFIPS 140-3, Common Criteria, and industry compliance documentation for QCORE-C1.
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